Soldering device.



-L. P. SMITH L J. GANTOR.

soLDERING DEVICE. APPLICATION FILED' DEG. so, 1910.

1 ,004,922, Patented 0011.3, 1-911.

COLUMBIA PLANUGRAPH C0.,WASH|NGTON. D. c.

Naniman strains rafrunr onirica.

LIONEL IE. SMITH, OF GOVINGTON, KENTUCKY, AND JULIUS CANTOR, OFCINCINNATI, OHIO.

SOLDERING DEVICE.

' To all whom it may concern:

Be it known that we, LIONEL P. SMITH and JULIUs CAN'roR, residents ofthe United States, residing at Covington, in the county of Kenton andState of Kentucky, and at Cincinnati, in the county of Hamilton andState of Ohio, respectively, have invented certain new and usefulImprovements in Soldering Devices, of which the following is aspecification,

Our invention relates to soldering devices, and more particularly todevices for soldering the bottoms or tops in cans of various shapes andsizes.

rIhe object of our invention is to produce a simple, inexpensive,eflicient and economically operated device for rapidly and neatlysoldering the bottoms or tops of cans securely therein.

Another object of our -invention is to produce a soldering device bymeans of which any number of cans may be soldered at the same time,according to the number of pedesta-ls and supports provided in the pan.

Our invention consists in a pan adapted to hold molten solder, means formelting and heating the solder and a pedestal having an overfiow andprovided with suitable support-s for the can.

Our invention also consists in the parts and combination of parts, andin the details of construction and arrangement as herein set forth andclaimed.

In the accompanying drawing which serves to illustrate the constructionand use of our invention: Figure 1 is a longitudinal vertical sectiontaken on the line 1-1 of Fig. 2. Fig. 2 is a plan view of our device.Fig. 3 is a fragmentary vertical section taken through one of thepedestals employed in our invention, showing the solder level and thecan in its proper position for soldering. Fig. 11 is a perspective viewof one of the pedestals.

In the embodiment of our invention as illustrated, and which shows apreferred construction, 1 represents a solder pan, with bowls or solderbasins 2 therein. The solder pan 1 is supported by means of side plates3, suitably fastened to the pan and provided with Ventilating holes 4Ctherein. The solder basins 2 may be divided, if desired, by means of apartition 5, and the ends of the pan are preferably provided withincline 6, to support bars of solder while being Specification ofLetters Patent.

Application filed December 30, 1910.

Patented Oct. 3, 1911. Serial No. 600,138.

ythat the can is adapted to rest. 1When the solder is placed upon theincline 6 of the pan 1, it is adapted to bey melted by any meansdesired, preferably by gas burner pipes 13,

lwhich are supplied by gas through a supply pipe 14:, provided with avalve 15 therein.

Enough solder is melted to bring the level of same up to a point abovethe lugs 12 on the neck 11 of the pedestal 8 or very close to the top ofthe pedestal. Slots 21 are prefer iably provided in the top edge of theneck 11 to permit the surplus of molten solder to overflow through theinterior of the pedes ital, and will thus drop down inside of thepedestal 8, through the opening 7 of the pan into the heating chamber15, where it will form into cakes, and may be readily re-.

moved and remelted.

In the soldering of cans in accordance with our invention, the body ofeach can is formed in the usual way with open ends. The bottom or top isformed with a flange and the flanged top or bottom is adapted to beplaced and fit tightly within the end of the body, in the manner shownin Fig. 3, the edge of the flange whether of the top or bottom,extending outwardly, as shown in said ligure. The bottoms or tops areplaced upon a surface with the flange extending downwardly, and the endsof the body portion are dipped in the flux or acid, and pressed over thetop or bottom, until the edges of` the can and the flange are even, asshown in Fig. 3. The assembled parts are then placed in the moltensolder upon the pedestals as shown in Fig. 3, where they are permittedto remain for a short time, and are then removed therefrom, by givingthe same a slight turn as it is being lifted out of the solder. Thisslight turn insures the covering with solder of the parts of the canresting on the lugs. The other end of the can is treated in the samemanner. This insures a uniform soldering of all cans, and the solder isuniformly and evenly distributed upon the top and bottom of each can,without any cracks or crevices, or openings of any kind to causeleakage.

The pan may have a single pedestal or as many basins and pedestals asdesired may be provided. When more than two basins with pedestals areprovided in a single pan, the intermediate basins may be replenishedwith molten solder by dipping with a ladle from the end basins into theintermediate basins to maintain the proper level of molten solder. Theproper level of molten solder may be maintained by melting additionalsolder, but a greatmany cans may be soldered without replenishing thesupply of solder beforey the level falls too low to take eect on thecans.

It will be seen that by the use of our invention the solder is appliedevenly and uniformly and no more solder is used than is necessary, thusa saving in the amount of solder used is effected, and there is no roughor uneven surface formed in soldering.

Inexperienced persons can readily and quickly assemble t-he parts andsolder the cans according to our invention. This dispenses with theexpense of soldering-irons, and it requires less heat to melt andmaintain the molten solder than it does to heat the soldering-irons.

VVit-h our invention a great many more cans can be soldered in a shorterlength of time, and the cans may be soldered with much less labor andexpense than otherwise.

Many modifications of our invention may be made wit-hout departing fromits spirit or scope, and we do not therefore desire to be limited to theexact details of construction and arrangement shown.

Ve claim:

l. A soldering device comprising a solder pan having an opening in thebottom thereof, a hollow pedestal mounted thereon and having a bodyportion, a neck portion at the top thereof, said neck extending upwardlyfrom said body portion, and a plurality of lugs extending laterally fromthe neck portion thereof at such a distance intermediate of the top andbottom of said neck as to support the article being soldered above thepedestal and provide a passage for the flow of the solder, substantiallyas set forth and for the purposes specified.

2. A device of the character described comprising a hollow pedestalhaving a body portion, a neck portion at the top thereof, a plurality oflugs extending laterally from the neck portion and just below the top ofsaid neck portion, and a slotted top to permit the surplus of moltensolder to overflow through the interior of the pedestal, substantiallyas set forth and for the purposes specified,

LIONEL P. SMITH. JULIUS CANTO-R.

Witnesses:

JAMES N. RAMSEY, WINONA DoAN.

Copies of this patent may be obtained for ve cents each, by addressingthe Commissioner of Patents, Washington, D. G.

